PD ES 59008-1:2000
Withdrawn
Date published:
Data requirements for semiconductor die, General requirements
Specifies requirements for the exchange of data pertaining to bare semiconductor die, with or without connection structures, and minimally-packaged semiconductor die. Also gives recommendations for general industry good practice in its use.
| Get this standard | Prices exclude GST | |
|---|---|---|
| PDF ( Single user document) |
$254.78 NZD
|
|
| HardCopy |
$288.70 NZD
|
|
Related Information
31.080.01 Semiconductor devices in general
Similar Standards
-
BS 3934-5:1997
Mechanical standardization of semiconductor devices, Recommendations applying to tape automated bonding (TAB) of integrated circuits
-
BS 7241:1989
Specification for IEC 822 VSB: parallel sub-system bus of the IEC 821 VME bus
-
BS EN 153000:1998
Harmonized system of quality assessment for electronic components. Generic specification: discrete pressure contact power semiconductor devices (qualification approval)
-
BS EN 60068-2-13:1999
Environmental testing. Test methods, Tests. Test M. Low air pressure
PD ES 59008-1:2000
Get this standard
Prices exclude GST
PDF
( Single user document)
$254.78 NZD
HardCopy
$288.70 NZD